Presentation
Implementation Challenges in complex 3D/heterogeneous architectures
DescriptionAs the design architectures get more complex with 2.5/3-D and heterogeneous aspects, continuous innovation is needed in both hardware space and the EDA software domain. This session focuses on various implementation challenges. The first talk is a discussion about the foundational EDA challenges in enabling 3D-ICs, including the system design and optimization of 3DIC architecture, multi-die co-design and co-optimization, and management of scale complexity. The second talk describes the physical design flows in the multi-die, adaptive compute acceleration platform for partially reconfigurable fabric. A combination of this flow and the architecture is capable of delivering high performance. The final talk is about the latest competitive situation between two power-delivery bonding technologies for 3D heterogeneous integration.
Event Type
Back-End Design
TimeMonday, July 10th1:30pm - 3:00pm PDT
Location2008, Level 2
Back-End Design