Chiplets – The New Frontier of Electronic Design! Challenges and Solutions in Chiplet-based Designs
DescriptionChiplets are revolutionizing the industry. They enable modular products combining dies of different process nodes optimally selected for specific functions: Performance-driven processor chiplets at 3nm, interconnect chiplets at 5nm and SRAM/Caches at 7nm can be combined in one platform using 2.5D and 3D advanced packaging technologies. It also removes reticle barrier allowing chiplet-based products to exceed much reticle limit. High routing density and short interconnect distance enable product segmentation to chiplets with minimal area, power and latency overhead.
However, this also adds additional complexity to electronics design, both because of the shear scale of integration, as well as the intricacies of interfacing different dies made by different players.
This session will review some of the challenges and possible solutions to those challenges
Event Type
Embedded Systems and Software
TimeWednesday, July 12th3:30pm - 5:00pm PDT
Location2010, 2nd Floor
Embedded Systems