Novel CAD Methodology for IR Drop and Reliability Verification of Stacked Dies (3D-IC)
DescriptionDesign house CAD and vendor tools are evolving to support sign-off of 3D-IC
To sign-off a 3D-IC product for Electromigration and IR drop (EMIR), a robust computer aided design (CAD) solution is needed for efficient power distribution network (PDN) verification across all IC components.
Engineering Track Poster
TimeWednesday, July 12th5:44pm - 5:46pm PDT
LocationLevel 2 Exhibit Hall