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Late Breaking Results: Analytical Placement for 3D ICs with Multiple Manufacturing Technologies
DescriptionThis paper proposes a high-quality 3D placement algorithm to determine the positions of standard cells and inter-die vias to optimize wirelength considering multiple manufacturing technologies for different dies. The algorithm consists of three major novel techniques: (1) a multi-technologies weighted-average (MTWA) wirelength model, (2) a weighted inter-die-connection cost controlling the net-degree distribution of the cut set, and (3) a via-cell co-optimization technique to improve the quality of placement solutions further. Compared with the winners at the 2022 CAD Contest at ICCAD on 3D Placement with D2D Vertical Connections, our placer achieves the best results for all nontrivial cases.
Event Type
Late Breaking Results Poster
TimeWednesday, July 12th6:00pm - 7:00pm PDT
LocationLevel 2 Lobby
Topics
AI
Autonomous Systems
Cloud
Design
EDA
Embedded Systems
IP
Security