Presentation
Where Will AI Change EDA: Inside, Outside or Not At All?
DescriptionAcademic researchers, as well as the EDA industry and its major customers, have invested enormous effort and resources in the quest to apply AI in EDA and IC design. There is now a substantial body of production experience with AI-boosted EDA tools and design methodologies. Clearly, EDA can be helped by AI. For the DAC community, this motivates questions that seek a next level of understanding:
(1) What benefits (from infusion of AI) have been seen by design organizations?
(2) What areas/directions in EDA are now seen as "dead ends” for AI application?
(3) What areas/directions are likely to bring the greatest future benefits?
(4) Should we look for future benefits of AI "inside” vendor tools, or "outside” in customer deployment and methodology built around vendor tools?
(5) Looking back from the year 2030, how will AI have fundamentally changed EDA and IC design?
(6) Where do EDA suppliers and design organizations diverge the most in their envisioning of AI's future in EDA and IC design?
This panel brings together experts from across tool development, business development, production deployment, and the leading edge of research for AI-boosted EDA. All panelists have deep experience with IC physical implementation and signoff, which has been a focus area for AI application in EDA.
(1) What benefits (from infusion of AI) have been seen by design organizations?
(2) What areas/directions in EDA are now seen as "dead ends” for AI application?
(3) What areas/directions are likely to bring the greatest future benefits?
(4) Should we look for future benefits of AI "inside” vendor tools, or "outside” in customer deployment and methodology built around vendor tools?
(5) Looking back from the year 2030, how will AI have fundamentally changed EDA and IC design?
(6) Where do EDA suppliers and design organizations diverge the most in their envisioning of AI's future in EDA and IC design?
This panel brings together experts from across tool development, business development, production deployment, and the leading edge of research for AI-boosted EDA. All panelists have deep experience with IC physical implementation and signoff, which has been a focus area for AI application in EDA.
Event Type
Research Panel
TimeWednesday, July 12th3:30pm - 5:30pm PDT
Location3014, 3rd Floor
AI
EDA