Presentation
On a Moreau Envelope Wirelength Model for Analytical Global Placement
DescriptionAnalytical placement is proved to be effective in global placement. The differentiability of wirelength models is very critical to gradient-based numerical optimization. Most previous works approximate the non-smooth half-perimeter wirelength (HPWL) model with various differentiable functions. In this paper, we propose a new differentiable wirelength model using the Moreau envelope to approximate HPWL. By combining the state-of-the-art electrostatic-based placement algorithm, the experimental results demonstrate that such an approximation model can achieve a 1% HPWL improvement compared to the most widely-used nonlinear wirelength model.
Event Type
Research Manuscript
TimeWednesday, July 12th4:10pm - 4:25pm PDT
Location3002, 3rd Floor
EDA
Physical Design and Verification