Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps
DescriptionMonolithic 3D ICs (M3D) realized using sequential integration or layer transfer have shown promising pathways to ultra-dense heterogenous 3D systems. Compared with the micron-scale inter-die bonding mechanisms such as micro-bumping and hybrid bonding, the nano-scale counterparts of M3D offer orders of magnitude more die-to-die connections with negligible RC parasitics. In addition to the ongoing research on perfecting the M3D manufacturing technology, the design community began searching for killer applications along with electronic design automation (EDA) tools to turn the ideas to manufacturable designs rapidly. In this talk, we present promising accomplishments from the M3D EDA community and discuss the gaps that must be filled to bring M3D to mainstream quickly.
Special Session (Research)
TimeThursday, July 13th5:00pm - 5:30pm PDT
Location3001, 3rd Floor