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DTSTAMP:20230712T175211Z
LOCATION:3012\, 3rd Floor
DTSTART;TZID=America/Los_Angeles:20230710T110000
DTEND;TZID=America/Los_Angeles:20230710T120000
UID:dac_DAC 2023_sess303_AM117@linklings.com
SUMMARY:CANCELLED: Designing for Automotive Functional Safety (FuSa) Requi
 rements
DESCRIPTION:Additional Meeting\n\nEd Sperling (Semiconductor Engineering),
  Francois Piednoel de Normandie (Mercedes-Benz), Uzi Baruch (proteanTecs),
  and Ramin Shirani (Ethernovia)\n\nJoin us on Monday, July 10 for this DAC
  panel discussion with industry experts from Mercedes-Benz, Ethernovia and
  proteanTecs as we discuss the latest automotive FuSa requirements and how
  they impact semiconductor design. \n \nTopics discussed: \n•	What is need
 ed to ensure optimal performance, reliability, and safety of automotive sy
 stems? \n•	How are chiplet-based designs and complex heterogeneous SoCs im
 pacting automotive designs? \n•	What role will AI/ ML play in shaping the 
 future of automotive technology? \n•	How can semiconductor companies meet 
 the safety and mission-profile KPIs of OEMs? \n\nCoffee, croissants, and f
 ruit will be served. Come 5-10 minutes early to network and find your seat
 . Seating is limited.   \n\nRegister and save your seat: https://go.protea
 ntecs.com/automotive-panel-july-10
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